Encapsulation parameters/Encapsulation: -
External dimensions/packaging: -
Other/Product Lifecycle: Obsolete
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TDA8215B
|
ST Microelectronics | 功能相似 | DIP-20 |
水平和垂直偏转电路 HORIZONTAL AND VERTICAL DEFLECTION CIRCUIT
|
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