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Model 60BGA-5
Description Soder-Wick® The desoldering and desoldering are encapsulated in an electrostatic dissipation reel. Greatly reduces rework/repair time and minimizes the risk of damage to the board. The patented non corrosive, halide free, wash free organic flux BGA desoldering design is used to remove solder from BGA pads and chips with a spool length of 1.5 or 3m. Note that Series 50 and Series 82 include rosin and rosin SD desoldering cores and tapes
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Brand: Illinois Tool Works
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Delivery time
Packaging method
Standard packaging quantity 1
51.19  yuan 51.19yuan
1+:
$ 58.8708
10+:
$ 56.3112
100+:
$ 55.8505
250+:
$ 55.4921
500+:
$ 54.9290
1000+:
$ 54.6731
2500+:
$ 54.3147
5000+:
$ 54.0076
Quantity
1+
10+
100+
250+
500+
Price
$58.8708
$56.3112
$55.8505
$55.4921
$54.9290
Price $ 58.8708 $ 56.3112 $ 55.8505 $ 55.4921 $ 54.9290
Start batch production 1+ 10+ 100+ 250+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(6138) Minimum order quantity(1)
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External dimensions/length: 1.5 m

Compliant with standards/RoHS standards: RoHS Compliant

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Model Brand Similarity Encapsulation Introduction Data manual

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  • ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
  • Address: Room 611, Block A, Aerospace Building, No. 4019, Shennan Avenue, Futian District, Shenzhen, Guangdong Province, China
  • Tel: +86-0755-82866643

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