Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: FBGA
External dimensions/packaging: FBGA
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A54SX72A-FGG256
|
Microsemi | 功能相似 | FBGA-256 |
FPGA - 现场可编程门阵列 SXA
|
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