Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 176
Encapsulation parameters/Encapsulation: LQFP-176
External dimensions/packaging: LQFP-176
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 功能相似 | LQFP-176 |
FPGA SX Family 8K Gates 512 Cells 320MHz 0.35um Technology 3.3V/5V 176Pin TQFP
|
||
A54SX08-2TQ176I
|
Microsemi | 功能相似 | LQFP-176 |
FPGA SX Family 8K Gates 512 Cells 320MHz 0.35um Technology 3.3V/5V 176Pin TQFP
|
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