Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP-176
External dimensions/packaging: LQFP-176
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A42MX24-TQG176A
|
Microsemi | 功能相似 | LQFP-176 |
Ic Fpga 150 i/o 176tqfp
|
||
A42MX24-TQG176A
|
SOC | 功能相似 | LQFP-176 |
Ic Fpga 150 i/o 176tqfp
|
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