Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LCC-68
External dimensions/packaging: LCC-68
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A40MX02-FPL68
|
Microsemi | 完全替代 | PLCC-68 |
单芯片ASIC的替代, 3000至54000个系统门,高达2.5千位可配置的双端口SRAM Single-Chip ASIC Alternative, 3,000 to 54,000 System Gates, Up to 2.5 kbits Configurable Dual-Port SRAM
|
||
A40MX02-PL68
|
SOC | 完全替代 | LCC-68 |
FPGA 40MX Family 3K Gates 295 Cells 83MHz/139MHz 0.45um (CMOS) Technology 3.3V/5V 68Pin PLCC
|
||
A40MX02-PL68
|
Microchip | 完全替代 | PLCC-68 |
FPGA 40MX Family 3K Gates 295 Cells 83MHz/139MHz 0.45um (CMOS) Technology 3.3V/5V 68Pin PLCC
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review