Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 484
Encapsulation parameters/Encapsulation: FBGA-484
External dimensions/length: 23 mm
External dimensions/width: 23 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA-484
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE600-1FG484
|
Microsemi | 类似代替 | BGA-484 |
ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
|
||
A3PE600-1FG484
|
SOC | 类似代替 | BGA-484 |
ProASIC3E闪存系列FPGA具有可选的软ARM支持 ProASIC3E Flash Family FPGAs with Optional Soft ARM Support
|
||
|
|
Actel | 类似代替 | BGA |
ProASIC3E 系列 600000 系统门 270 I/O 1.575V 表面贴装 FPGA -FPBGA-484
|
||
A3PE600-2FGG484I
|
SOC | 类似代替 | BGA-484 |
ProASIC3E 系列 600000 系统门 270 I/O 1.575V 表面贴装 FPGA -FPBGA-484
|
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