Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 896
Encapsulation parameters/Encapsulation: FBGA-896
External dimensions/length: 31 mm
External dimensions/width: 31 mm
External dimensions/height: 1.73 mm
External dimensions/packaging: FBGA-896
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3PE3000-FG896
|
Microsemi | 完全替代 | FBGA-896 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 896Pin FBGA
|
||
A3PE3000-FG896
|
SOC | 完全替代 | BGA-896 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 896Pin FBGA
|
||
A3PE3000-FG896I
|
SOC | 类似代替 | BGA-896 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 896Pin FBGA
|
||
|
|
Microsemi | 完全替代 | FBGA-896 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 896Pin FBGA
|
||
|
|
SOC | 完全替代 | BGA-896 |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 896Pin FBGA
|
||
A3PE3000-FGG896
|
Actel | 完全替代 | BGA |
FPGA ProASIC®3E Family 3M Gates 231MHz 130nm Technology 1.5V 896Pin FBGA
|
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