Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.425V ~ 1.575V
Technical parameters/power supply voltage (Max): 1.575 V
Technical parameters/power supply voltage (Min): 1.425 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: FBGA-256
External dimensions/length: 17 mm
External dimensions/width: 17 mm
External dimensions/height: 1.2 mm
External dimensions/packaging: FBGA-256
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3P250-FG256
|
SOC | 完全替代 | LBGA-256 |
130纳米， 7层金属（ 6铜） ，基于闪存的CMOS工艺 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
|
||
A3P250-FG256
|
Microchip | 完全替代 | FBGA-256 |
130纳米， 7层金属（ 6铜） ，基于闪存的CMOS工艺 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS Process
|
||
A3P250-FG256I
|
SOC | 类似代替 | LBGA-256 |
FPGA ProASIC®3 Family 250K Gates 231MHz 130nm Technology 1.5V 256Pin FBGA
|
||
|
|
Actel | 完全替代 | FPBGA-256 |
地面FPGA和SoC产品目录 Terrestrial FPGA and SoC Product Catalog
|
||
|
|
Microchip | 完全替代 | FBGA-256 |
地面FPGA和SoC产品目录 Terrestrial FPGA and SoC Product Catalog
|
||
A3P250-FGG256
|
Microsemi | 完全替代 | FBGA-256 |
地面FPGA和SoC产品目录 Terrestrial FPGA and SoC Product Catalog
|
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