Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 256
Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/packaging: LBGA-256
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A3P250-FG256I
|
SOC | 完全替代 | LBGA-256 |
FPGA ProASIC®3 Family 250K Gates 231MHz 130nm Technology 1.5V 256Pin FBGA
|
||
|
|
Actel | 完全替代 | FPBGA-256 |
地面FPGA和SoC产品目录 Terrestrial FPGA and SoC Product Catalog
|
||
|
|
Microchip | 完全替代 | FBGA-256 |
地面FPGA和SoC产品目录 Terrestrial FPGA and SoC Product Catalog
|
||
A3P250-FGG256
|
Microsemi | 完全替代 | FBGA-256 |
地面FPGA和SoC产品目录 Terrestrial FPGA and SoC Product Catalog
|
||
|
|
Actel | 完全替代 | BGA |
A3P250 系列 250 k 门 2 k 宏单元 36 Kb Ram 157 I/O - FG256
|
||
A3P250-FGG256I
|
SOC | 完全替代 | LBGA-256 |
A3P250 系列 250 k 门 2 k 宏单元 36 Kb Ram 157 I/O - FG256
|
||
A3P250-FGG256I
|
Microsemi | 完全替代 | FBGA-256 |
A3P250 系列 250 k 门 2 k 宏单元 36 Kb Ram 157 I/O - FG256
|
||
A3P250-FGG256I
|
Microchip | 完全替代 | FBGA-256 |
A3P250 系列 250 k 门 2 k 宏单元 36 Kb Ram 157 I/O - FG256
|
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