Technical parameters/power supply voltage: 1.425V ~ 1.575V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 144
Encapsulation parameters/Encapsulation: LBGA-144
External dimensions/packaging: LBGA-144
Physical parameters/operating temperature: -40℃ ~ 125℃ (TA)
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards:
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
SOC | 完全替代 | LBGA-144 |
FPGA ProASIC®3 Family 1M Gates 272MHz 130nm Technology 1.5V 144Pin FBGA
|
||
|
|
SOC | 完全替代 | LBGA-144 |
FPGA ProASIC®3 Family 1M Gates 272MHz 130nm Technology 1.5V 144Pin FBGA
|
||
A3P1000-1FGG144I
|
Microsemi | 完全替代 | LBGA-144 |
FPGA ProASIC®3 Family 1M Gates 272MHz 130nm Technology 1.5V 144Pin FBGA
|
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