Encapsulation parameters/Encapsulation: BGA-484
External dimensions/packaging: BGA-484
Physical parameters/operating temperature: -40℃ ~ 100℃ (TJ)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A2F500M3G-1FGG484
|
SOC | 类似代替 | BGA-484 |
的SmartFusion可定制系统级芯片( CSOC ) SmartFusion Customizable System-on-Chip (cSoC)
|
||
|
|
Actel | 完全替代 | FPBGA-484 |
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 484Pin FBGA
|
||
A2F500M3G-1FGG484I
|
SOC | 完全替代 | BGA-484 |
FPGA SmartFusion Family 500K Gates 100MHz 130nm Technology 1.5V 484Pin FBGA
|
||
A2F500M3G-FGG484I
|
Microsemi | 完全替代 | FPBGA-484 |
FPGA - 现场可编程门阵列 SmartFusion
|
||
A2F500M3G-FGG484I
|
SOC | 完全替代 | BGA-484 |
FPGA - 现场可编程门阵列 SmartFusion
|
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