Encapsulation parameters/Encapsulation: LBGA-256
External dimensions/packaging: LBGA-256
Physical parameters/operating temperature: 0℃ ~ 85℃ (TJ)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
A2F500M3G-1FG256
|
Microsemi | 完全替代 | FPBGA-256 |
其他系列 100MHz 512KB 64KB
|
||
A2F500M3G-FGG256I
|
Microsemi | 类似代替 | FPBGA-256 |
ARM Cortex-M3 80MHz 闪存:512KB RAM:64KB
|
||
A2F500M3G-FGG256I
|
SOC | 类似代替 | LBGA-256 |
ARM Cortex-M3 80MHz 闪存:512KB RAM:64KB
|
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