Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: LQFP
External dimensions/packaging: LQFP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
TSB12LV21BIPGF
|
TI | 功能相似 | LQFP |
PCILynx - PCI to 1394 3.3V Link Layer with 32Bit PCI I/F, 4K FIFOs 176-LQFP -40℃ to 85℃
|
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