Technical parameters/power supply voltage: 2.97V ~ 3.63V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP-20
External dimensions/packaging: TSSOP-20
Physical parameters/operating temperature: 0℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS1670E+
|
Dallas Semiconductor | 类似代替 | TSSOP |
MAXIM INTEGRATED PRODUCTS DS1670E+ 芯片, 实时时钟
|
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