Technical parameters/Contact electroplating: Silver
Technical parameters/direction: Vertical
Technical parameters/number of pins: 6
Technical parameters/rated current (Max): 0.2A @28VDC
Technical parameters/rated voltage: 28 VDC
Technical parameters/Contact resistance (Max): 10 mΩ
Encapsulation parameters/installation method: Panel, Solder Lug
Encapsulation parameters/Encapsulation: 200
External dimensions/length: 14.27 mm
External dimensions/width: 14.27 mm
External dimensions/height: 35.46 mm
External dimensions/diameter: 14.3 mm
External dimensions/packaging: 200
Physical parameters/contact material: Metal Alloy
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536509020
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