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Description LinCMOS Operational amplifier # # # Operational amplifier, Texas Instruments
Product QR code
Brand: TI
Packaging PDIP-14
Delivery time
Packaging method Tube
Standard packaging quantity 1
24.85  yuan 24.85yuan
5+:
$ 29.0768
50+:
$ 27.8342
200+:
$ 27.1384
500+:
$ 26.9644
1000+:
$ 26.7905
2500+:
$ 26.5916
5000+:
$ 26.4674
7500+:
$ 26.3431
Quantity
5+
50+
200+
500+
1000+
Price
$29.0768
$27.8342
$27.1384
$26.9644
$26.7905
Price $ 29.0768 $ 27.8342 $ 27.1384 $ 26.9644 $ 26.7905
Start batch production 5+ 50+ 200+ 500+ 1000+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(2820) Minimum order quantity(5)
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Technical parameters/output current: ≤30 mA

Technical parameters/power supply current: 3.8 mA

Technical parameters/number of circuits: 4

Technical parameters/number of channels: 4

Technical parameters/dissipated power: 1.575 W

Technical parameters/common mode rejection ratio: 65 dB

Technical parameters/Input compensation drift: 1.80 µV/K

Technical parameters/bandwidth: 1.70 MHz

Technical parameters/conversion rate: 3.60 V/μs

Technical parameters/gain bandwidth product: 1.7 MHz

Technical parameters/input compensation voltage: 370 µV

Technical parameters/input bias current: 0.7 pA

Technical parameters/operating temperature (Max): 70 ℃

Technical parameters/operating temperature (Min): 0 ℃

Technical parameters/gain bandwidth: 2.2 MHz

Technical parameters/dissipated power (Max): 1575 mW

Technical parameters/Common Mode Rejection Ratio (Min): 65 dB

Encapsulation parameters/installation method: Through Hole

Package parameters/number of pins: 14

Encapsulation parameters/Encapsulation: PDIP-14

External dimensions/length: 19.3 mm

External dimensions/width: 6.35 mm

External dimensions/height: 4.57 mm

External dimensions/packaging: PDIP-14

Physical parameters/operating temperature: 0℃ ~ 70℃

Other/Product Lifecycle: Active

Other/Packaging Methods: Tube

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: Lead Free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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