Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: SOIC-8
External dimensions/length: 4.9 mm
External dimensions/width: 3.9 mm
External dimensions/height: 1.5 mm
External dimensions/packaging: SOIC-8
External dimensions/thickness: 1.50 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
NB3N2302DG
|
ON Semiconductor | 功能相似 | SOIC-8 |
时钟发生器,On Semiconductor 发射器耦合逻辑 (ECL) 算术功能,如计数器、分频器 ### 时钟发生器/缓冲器
|
||
NB3N2302DR2G
|
ON Semiconductor | 功能相似 | SOIC-8 |
Zero Delay Buffer, 5MHz - 133MHz Frequency Multiplier, 3.3V / 5V
|
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