Technical parameters/Contact electroplating: Tin Lead
Technical parameters/rated current (Max): 11.2 A
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -55 ℃
Technical parameters/Contact resistance (Max): 10 mΩ
Encapsulation parameters/installation method: Through Hole
External dimensions/height: 2.99 mm
External dimensions/inner diameter dimensions: 1.65 mm
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Active
Other/Packaging Methods: Bulk
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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