Technical parameters/dissipated power: 2200 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -20 ℃
Technical parameters/dissipated power (Max): 2200 mW
Package parameters/number of pins: 24
Encapsulation parameters/Encapsulation: SOIC
External dimensions/height: 2.35 mm
External dimensions/packaging: SOIC
Compliant with standards/RoHS standards: Non-Compliant
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