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Description KEL 8900 Series 1.27mm Low Profile Board to Board PCB Headers 8900 series PCB mount board to board header connectors with a 1.27mm pitch, low profile design and low insertion and withdrawal force. These 8900 series 1.27mm PCB plugs have a single-point spring contact design that assures a reliable electrical connection. The housings of these 8900 series board to board header connectors are designed to prevent misinsertion and feature a guide mechanism to aid accurate mating. The connector produces an audible click to indicate when mating is complete. PCB hooks are featured on these 8900 PCB headers to secure the connector to the PCB during the soldering process. These 8900 series board to board PCB headers support stacking, horizontal and vertical board to board applications and have a range of stacking heights. 8911-xxx-178S-A-F have a stacked height of 7mm, 8mm and 10mm 8911-xxx-178S-C-F have a stacked height of 9mm, 10mm and 12mm These 8900 series PCB mount board to board header connectors mate with the 8900 series PCB mount board to board socket connectors Low profile design Low insertion and withdrawal force One point spring contact design for a reliable electrical connection Guide mechanism to aid accurate mating Audible click indicates complete mating PCB boardlocks for secure connection to PCB Supports stacking, vertical and horizontal board to board applications Wide range of mating heights ### 1.27mm Board to Board - KEL
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Brand: KEL
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Standard packaging quantity 1
53.57  yuan 53.57yuan
1+:
$ 61.6044
10+:
$ 58.9259
100+:
$ 58.4438
250+:
$ 58.0688
500+:
$ 57.4795
1000+:
$ 57.2117
2500+:
$ 56.8367
5000+:
$ 56.5153
Quantity
1+
10+
100+
250+
500+
Price
$61.6044
$58.9259
$58.4438
$58.0688
$57.4795
Price $ 61.6044 $ 58.9259 $ 58.4438 $ 58.0688 $ 57.4795
Start batch production 1+ 10+ 100+ 250+ 500+
  • Freight charges   In stock Freight rate:$13.00
  • Quantity
    Inventory(9267) Minimum order quantity(1)
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Technical parameters/number of contacts: 100

Technical parameters/rated current: 0.5 A

Technical parameters/number of rows: 2

Encapsulation parameters/installation method: Through Hole

Physical parameters/contact material: Copper Alloy

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