Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 28
Encapsulation parameters/Encapsulation: SOIC-28
External dimensions/length: 17.9 mm
External dimensions/width: 7.6 mm
External dimensions/height: 2.34 mm
External dimensions/packaging: SOIC-28
External dimensions/thickness: 2.34 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
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