Technical parameters/Contact electroplating: Gold, Tin Lead
Technical parameters/insulation resistance: 5.00 GΩ
Technical parameters/number of pins: 22
Technical parameters/Contact resistance: 10.0 mΩ
Encapsulation parameters/installation method: Vertical
Physical parameters/contact material: Beryllium Copper
Other/Product Lifecycle: Active
Other/Packaging Methods: Box, Tube
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/ELV standards: Non-Compliant
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