Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 324
Encapsulation parameters/Encapsulation: FCBGA-324
External dimensions/length: 19.0 mm
External dimensions/width: 19 mm
External dimensions/packaging: FCBGA-324
External dimensions/thickness: 3.27 mm
Other/Product Lifecycle: Not Recommended for New Designs
Other/Packaging Methods: Tray
Other/Manufacturing Applications: Wireless infrastructure
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
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