Encapsulation parameters/installation method: Through Hole
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: PDIP
External dimensions/packaging: PDIP
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
ST Microelectronics | 功能相似 | PDIP |
前置放大器,用于红外遥控系统 PREAMPLIFIER FOR INFRARED REMOTE CONTROL SYSTEMS
|
||
TMS3637D
|
TI | 功能相似 | SOIC |
遥控发射器/接收器 Remote Control Transmitter/Receiver
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review