Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74LS670N
|
Rochester | 功能相似 | DIP |
TEXAS INSTRUMENTS SN74LS670N 移位寄存器, LS系列, 注册文件, 通用, 1元件, DIP, 16 引脚, 4.75 V, 5.25 V
|
||
SN74LS670N
|
ON Semiconductor | 功能相似 | DIP |
TEXAS INSTRUMENTS SN74LS670N 移位寄存器, LS系列, 注册文件, 通用, 1元件, DIP, 16 引脚, 4.75 V, 5.25 V
|
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