Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 208
Encapsulation parameters/Encapsulation: BFQFP-208
External dimensions/packaging: BFQFP-208
Physical parameters/operating temperature: 0℃ ~ 70℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
Xilinx | 类似代替 | BFQFP-208 |
XCR3512XL 10PQ208C 磨码
|
||
XCR3512XL-10PQG208C
|
Xilinx | 类似代替 | BFQFP-208 |
XCR3512XL 10PQG208C 磨码
|
||
XCR3512XL-7PQG208C
|
Xilinx | 类似代替 | BFQFP-208 |
XCR3512XL 7PQG208C 磨码
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review