Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
ADG1408YRUZ
|
ADI | 功能相似 | TSSOP-16 |
ANALOG DEVICES ADG1408YRUZ 芯片, 多路复用器, 8路
|
||
ADG1408YRUZ-REEL
|
ADI | 功能相似 | TSSOP-16 |
4.7欧姆的最大导通电阻 4.7 OHM maximum on resistance
|
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