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Model PMEG3010CEH,115
Description Schottky barrier diode, 1A to 1.5A, Nexperia efficient ultra small thin surface mount package optimized for low forward voltage drop, high junction temperature, low capacitance, negligible power switching loss, low leakage current
Product QR code
Brand: Nexperia
Packaging SOD-123F
Delivery time
Packaging method Tape & Reel (TR)
Standard packaging quantity 1
0.29  yuan 0.29yuan
20+:
$ 0.3942
50+:
$ 0.3650
100+:
$ 0.3504
300+:
$ 0.3387
500+:
$ 0.3300
1000+:
$ 0.3241
5000+:
$ 0.3183
10000+:
$ 0.3124
Quantity
20+
50+
100+
300+
500+
Price
$0.3942
$0.3650
$0.3504
$0.3387
$0.3300
Price $ 0.3942 $ 0.3650 $ 0.3504 $ 0.3387 $ 0.3300
Start batch production 20+ 50+ 100+ 300+ 500+
Check the distribution price
  • Freight charges：   In stock Freight rate：$13.00
  • Quantity： Inventory(6450) Minimum order quantity(20)
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Technical parameters/forward voltage: 520mV @1A

Technical parameters/thermal resistance: 60℃/W (RθJL)

Technical parameters/forward current: 1000 mA

Technical parameters/Maximum forward surge current (Ifsm): 9 A

Technical parameters/forward voltage (Max): 520mV @1A

Technical parameters/forward current (Max): 1 A

Technical parameters/operating temperature (Max): 150 ℃

Technical parameters/operating temperature (Min): -65 ℃

Technical parameters/operating temperature: 150℃ (Max)

Technical parameters/dissipated power (Max): 830 mW

Encapsulation parameters/installation method: Surface Mount

Package parameters/number of pins: 2

Encapsulation parameters/Encapsulation: SOD-123F

External dimensions/length: 2.7 mm

External dimensions/width: 1.7 mm

External dimensions/height: 1.2 mm

External dimensions/packaging: SOD-123F

Other/Product Lifecycle: Active

Other/Packaging Methods: Tape & Reel (TR)

Compliant with standards/RoHS standards: RoHS Compliant

Compliant with standards/lead standards: lead-free

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Alternative material

Model Brand Similarity Encapsulation Introduction Data manual
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PMEG3010CEH,115 PMEG3010CEH,115 Nexperia 功能相似 SOD-123F
肖特基势垒二极管，1A 至 1.5A，Nexperia 高效 超小薄型表面安装封装 经优化适用于低正向电压降和高结温 低电容 可忽略的功率切换损耗 低漏泄电流
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