Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-16
External dimensions/packaging: TSSOP-16
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74VHC595MTC
|
Fairchild | 完全替代 | TSSOP-16 |
ON Semiconductor 串行至并行 移位寄存器 74VHC595MTC, 2 → 5.5 V电源, 16引脚 TSSOP封装
|
||
74VHC595MTC
|
Fairchild | 完全替代 | TSSOP-16 |
ON Semiconductor 串行至并行 移位寄存器 74VHC595MTC, 2 → 5.5 V电源, 16引脚 TSSOP封装
|
||
74VHC595MTC
|
ON Semiconductor | 完全替代 | TSSOP-16 |
ON Semiconductor 串行至并行 移位寄存器 74VHC595MTC, 2 → 5.5 V电源, 16引脚 TSSOP封装
|
||
MC74VHC595DTR2G
|
ON Semiconductor | 类似代替 | TSSOP-16 |
ON SEMICONDUCTOR MC74VHC595DTR2G 移位寄存器, HC系列, 串行至并行、串行至串行, TSSOP, 16 引脚, 2 V, 5.5 V 新
|
||
SN74AHC595PW
|
TI | 类似代替 | TSSOP-16 |
TEXAS INSTRUMENTS SN74AHC595PW 移位寄存器, AHC系列, 串行至并行, 1元件, TSSOP, 16 引脚, 2 V, 5.5 V
|
||
SN74AHC595PW
|
TI | 类似代替 | TSSOP-16 |
TEXAS INSTRUMENTS SN74AHC595PW 移位寄存器, AHC系列, 串行至并行, 1元件, TSSOP, 16 引脚, 2 V, 5.5 V
|
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