Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP
External dimensions/packaging: TSSOP
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
NXP | 完全替代 | TSSOP |
3.3V OCTAL D FF POS EDGE 3-S
|
||
|
|
NXP | 完全替代 | TSSOP |
3.3V OCTAL D FF POS EDGE 3-S
|
||
74LVC574APW
|
Philips | 完全替代 | TSSOP-20 |
3.3V OCTAL D FF POS EDGE 3-S
|
||
74LVC574APW,118
|
Nexperia | 类似代替 | TSSOP-20 |
NXP 74LVC574APW,118 触发器, 三态, 正沿, D, 200 MHz, TSSOP, 20 引脚
|
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