Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 250 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 8
Encapsulation parameters/Encapsulation: VSSOP
External dimensions/length: 2.4 mm
External dimensions/width: 2.1 mm
External dimensions/height: 0.85 mm
External dimensions/packaging: VSSOP
Other/Product Lifecycle: Active
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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Rochester | 完全替代 |
74LVC 系列模拟开关,Nexperia 低电压 CMOS 逻辑 单门封装 工作电压:1.65 至 5.5 V 兼容性:输入 LVTTL/TTL,输出 LVCMOS ### 74LVC 系列
|
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74LVC2G66DP
|
NXP | 完全替代 | SOT-505-2 |
74LVC 系列模拟开关,Nexperia 低电压 CMOS 逻辑 单门封装 工作电压:1.65 至 5.5 V 兼容性:输入 LVTTL/TTL,输出 LVCMOS ### 74LVC 系列
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