Technical parameters/power supply current: 40 µA
Technical parameters/number of circuits: 1
Technical parameters/number of channels: 1
Technical parameters/dissipated power: 250 mW
Technical parameters/bandwidth: 200 MHz
Technical parameters/3dB bandwidth: 300 MHz
Technical parameters/dissipated power (Max): 250 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 6
Encapsulation parameters/Encapsulation: XFDFN-6
External dimensions/packaging: XFDFN-6
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74LVC1G3157GF,132
|
NXP | 类似代替 | XFDFN-6 |
74LVC 系列 5.5 V 双通道 模拟 多路复用器/解复用器 - XSON-6
|
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