Encapsulation parameters/installation method: Surface Mount
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74LVC02ADR
|
TI | 功能相似 | SOIC-14 |
TEXAS INSTRUMENTS SN74LVC02ADR. 逻辑芯片, 或非门, 四路, SOIC-14
|
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