Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SSOP-16
External dimensions/packaging: SSOP-16
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
SN74LVC2G157DCUT
|
TI | 功能相似 | SOIC-8 |
TEXAS INSTRUMENTS SN74LVC2G157DCUT 逻辑芯片, 数据选择器/多路复用器, 2-1, 单路, 8SOIC
|
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