Technical parameters/power supply voltage: 4.5V ~ 5.5V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC-16
External dimensions/packaging: SOIC-16
Physical parameters/operating temperature: -40℃ ~ 125℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC670D,652
|
NXP | 类似代替 | SOIC-16 |
NXP 74HC670D,652 移位寄存器, HC系列, 高速CMOS, 通用, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
74HCT670D,652
|
NXP | 完全替代 | SOIC-16 |
NXP 74HCT670D,652 移位寄存器, HCT系列, 高速CMOS, 通用, 1元件, SOIC, 16 引脚, 4.5 V, 5.5 V
|
||
|
|
Nexperia | 类似代替 | SO-16 |
Register File Single 4CH CMOS 16Pin SO T/R
|
||
74HCT670D,653
|
NXP | 类似代替 | SOIC-16 |
Register File Single 4CH CMOS 16Pin SO T/R
|
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