Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SSOP-16
External dimensions/packaging: SSOP-16
Other/Case/Package: 16-SSOP
Other/소イ당비プ개수: 직렬 - 병렬
Other/소イ개수: 8
Other/작동온도: 표면실장(SMD, SMT)
Other/실동형: 16-SOIC
Other/능: 4.5 V ~ 5.5 V
Other/논イ형: 3상태
Other/계 New: 시프트 레지스터
Other/출력イ형: 1
Other - 공급: -40°C ~ 125°C
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