Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP-16
External dimensions/packaging: DIP-16
Other/Case/Package: 16-DIP(0.300
Other/메모イ크ち: 64(16 x 4)
Other - 공급: 4.5 V ~ 5.5 V
Other/능: 비동기
Other/실동형: 스루홀
Other/터속도: 25MHz
Other/작동온도: -40°C ~ 125°C
Other/계 New: 74HCT
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