Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: TSSOP-14
External dimensions/packaging: TSSOP-14
Other/Case/Package: 14-TSSOP
Other - 공급: 4.5 V ~ 5.5 V
Other/논イ레벨 - 높음: 2V
Other/♪대ン파イ Contact @ V, ♪대 CL: 24ns @ 4.5V, 50pF
Other/실동형: 표면실장(SMD, SMT)
Other/류 - 출력, 저출력: -, 4mA
Other/입력개수: 2
Other/회로개수: 4
Other/작동온도: -40°C ~ 125°C
Other/논イ형: NAND 게이트
Other/계 New: 74HCT
Other/논イ레벨 - 낮음: 0.8V
Other/특징: 개방 드레인
Other/류 - 대ち (대대): 2μA
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