Technical parameters/number of pins: 16
Technical parameters/operating temperature (Max): 125 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/power supply voltage (Max): 6 V
Technical parameters/power supply voltage (Min): 2 V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 16
Encapsulation parameters/Encapsulation: SOIC
External dimensions/length: 10 mm
External dimensions/width: 4 mm
External dimensions/height: 1.45 mm
External dimensions/packaging: SOIC
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: PB free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC4094D,653
|
Nexperia | 类似代替 | SOIC-16 |
NXP 74HC4094D,653 移位寄存器, HC系列, 移位存储, 串行至并行、串行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
74HC4094N
|
Philips | 完全替代 | DIP |
NXP 74HC4094N 移位寄存器, 串行至并行, 1元件, DIP, 16 引脚, 2 V, 6 V
|
||
74HC4094N
|
NXP | 完全替代 | DIP |
NXP 74HC4094N 移位寄存器, 串行至并行, 1元件, DIP, 16 引脚, 2 V, 6 V
|
||
CD74HC4094M
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS CD74HC4094M 移位寄存器, HC系列, 移位存储, 串行至并行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
CD74HC4094M96
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS CD74HC4094M96 移位寄存器, HC系列, 高速CMOS, 串行至并行、串行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
||
CD74HC4094M96
|
TI | 功能相似 | SOIC-16 |
TEXAS INSTRUMENTS CD74HC4094M96 移位寄存器, HC系列, 高速CMOS, 串行至并行、串行至串行, 1元件, SOIC, 16 引脚, 2 V, 6 V
|
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