Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: TSSOP-20
External dimensions/packaging: TSSOP-20
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74HC273PW,112
|
NXP | 功能相似 | TSSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 1Element 20Pin TSSOP Tube
|
||
74HC273PW,112
|
Nexperia | 功能相似 | TSSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 1Element 20Pin TSSOP Tube
|
||
74HC273PW,112
|
NXP | 功能相似 | TSSOP-20 |
Flip Flop D-Type Bus Interface Pos-Edge 1Element 20Pin TSSOP Tube
|
||
MC74HC273ADT
|
ON Semiconductor | 功能相似 | TSSOP-20 |
带公共时钟和复位八路D触发器 OCTAL D FLIP FLOP WITH COMMON CLOCK AND RESET
|
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