Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 20
Encapsulation parameters/Encapsulation: SSOP
External dimensions/packaging: SSOP
Other/Product Lifecycle: Unknown
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
CD74ACT299M
|
TI | 功能相似 | SOIC-20 |
TEXAS INSTRUMENTS CD74ACT299M 移位寄存器, 通用, 1元件, SOIC, 20 引脚, 4.5 V, 5.5 V
|
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