Encapsulation parameters/Encapsulation: SOP
External dimensions/packaging: SOP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: Non-Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
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TI | 完全替代 | DIP |
NXP 74HC139N 芯片, 74HC CMOS逻辑器件
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HGSEMI | 完全替代 | DIP-16 |
NXP 74HC139N 芯片, 74HC CMOS逻辑器件
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|
ON Semiconductor | 完全替代 | DIP |
NXP 74HC139N 芯片, 74HC CMOS逻辑器件
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74HC139N
|
Rochester | 完全替代 | DIP |
NXP 74HC139N 芯片, 74HC CMOS逻辑器件
|
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SN74HC139N
|
National Semiconductor | 功能相似 | 16 |
TEXAS INSTRUMENTS SN74HC139N 芯片, 逻辑电路 - 译码器/数据选择器
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