Encapsulation parameters/installation method: Through Hole
Encapsulation parameters/Encapsulation: DIP
External dimensions/packaging: DIP
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
|
|
HGSEMI | 功能相似 | DIP-14 |
NXP 74HC02N 逻辑芯片, 或非门, CMOS, 74HC02, 5V, DIP14
|
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|
|
National Semiconductor | 功能相似 | DIP |
NXP 74HC02N 逻辑芯片, 或非门, CMOS, 74HC02, 5V, DIP14
|
||
74HC02N
|
Philips | 功能相似 | DIP |
NXP 74HC02N 逻辑芯片, 或非门, CMOS, 74HC02, 5V, DIP14
|
||
|
|
Harris | 功能相似 | DIP |
TEXAS INSTRUMENTS CD74HC02E 或非门, HC系列, 4门, 2输入, 5.2 mA, 2V至6V, DIP-14
|
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