Technical parameters/dissipated power: 1610 W
Technical parameters/input current (Min): 10 µA
Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): -10 ℃
Technical parameters/dissipated power (Max): 1610 mW
Technical parameters/power supply voltage: 3V ~ 3.6V
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 64
Encapsulation parameters/Encapsulation: FBGA-64
External dimensions/packaging: FBGA-64
Physical parameters/operating temperature: -10℃ ~ 70℃
Other/Product Lifecycle: Active
Other/Packaging Methods: Tape & Reel (TR)
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
DS90CF386SLC
|
National Semiconductor | 类似代替 | LFBGA |
LVDS 接口集成电路
|
||
DS90CF386SLC
|
TI | 类似代替 | FBGA-64 |
LVDS 接口集成电路
|
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