Encapsulation parameters/installation method: Surface Mount
Encapsulation parameters/Encapsulation: SOT-363
External dimensions/packaging: SOT-363
Other/Product Lifecycle: Unknown
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74AUP1G158GW
|
NXP | 功能相似 | TSSOP-6 |
IC, 2INPUT MUX INV, LOW PWR, SC-88; Logic Type: Multiplexer; No. of Channels: 1; Ratio: 2: 1; Supply Voltage Min: 0....
|
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