Technical parameters/dissipated power: 850 mW
Technical parameters/operating temperature (Max): 85 ℃
Technical parameters/operating temperature (Min): -40 ℃
Technical parameters/dissipated power (Max): 850 mW
Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TFSOP-56
External dimensions/height: 1.05 mm
External dimensions/packaging: TFSOP-56
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Active
Other/Packaging Methods: Tube
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVCH16646DGG:11
|
NXP | 功能相似 | TSSOP-56 |
IC TRANSCVR 16Bit N-INV 56TSSOP
|
||
74ALVCH16646DGGS
|
Nexperia | 完全替代 | TFSOP-56 |
Bus XCVR Dual 16CH 3-ST 56Pin TSSOP Tube
|
||
74ALVCH16646DGGS
|
NXP | 完全替代 | TFSOP-56 |
Bus XCVR Dual 16CH 3-ST 56Pin TSSOP Tube
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review