Encapsulation parameters/installation method: Surface Mount
Package parameters/number of pins: 56
Encapsulation parameters/Encapsulation: TSSOP-56
External dimensions/packaging: TSSOP-56
Physical parameters/operating temperature: -40℃ ~ 85℃ (TA)
Other/Product Lifecycle: Obsolete
Compliant with standards/RoHS standards:
Compliant with standards/lead standards: lead-free
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
74ALVCH16952DGGS
|
NXP | 完全替代 | TFSOP-56 |
Bus XCVR Dual 16CH 3-State 56Pin TSSOP Tube
|
||
74ALVCH16952DGGS
|
Nexperia | 完全替代 | TFSOP-56 |
Bus XCVR Dual 16CH 3-State 56Pin TSSOP Tube
|
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