Technical parameters/installation angle: 180 °
Technical parameters/operating temperature (Max): 165 ℃
Technical parameters/operating temperature (Min): -65 ℃
Encapsulation parameters/installation method: Solder, Panel
Physical parameters/contact material: Beryllium Copper
Other/Packaging Methods: Bag
Compliant with standards/RoHS standards: RoHS Compliant
Compliant with standards/lead standards: Lead Free
Customs information/ECCN code: EAR99
Customs information/HTS code: 8536694010
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