Technical parameters/operating temperature (Max): 70 ℃
Technical parameters/operating temperature (Min): 0 ℃
Technical parameters/power supply voltage: 1.8 V
Package parameters/number of pins: 165
Encapsulation parameters/Encapsulation: BGA
External dimensions/length: 15.0 mm
External dimensions/width: 13.0 mm
External dimensions/height: 0.85 mm
External dimensions/packaging: BGA
External dimensions/thickness: 1.20 mm
Other/Product Lifecycle: Obsolete
Other/Packaging Methods: Tray
Compliant with standards/RoHS standards: Non-Compliant
Compliant with standards/lead standards: Contains Lead
| Model | Brand | Similarity | Encapsulation | Introduction | Data manual | |
|---|---|---|---|---|---|---|
71P74604S250BQ
|
Integrated Device Technology | 完全替代 | BGA |
SRAM Chip Sync Dual 1.8V 18M-Bit 512K x 36 0.45ns 165Pin CABGA
|
©Copyright 2013-2025 ICGOODFIND (Shenzhen) Electronics Technology Co., Ltd.
The most helpful review